Description:
Semiconductor Manufacturing,Semiconductors and Related Devices,SEMPAC’s “Open-Pakâ€â„¢ packages meet the latest JEDEC outline & footprint standards and are available in QFN,QFP,SOIC and SSOP architectures,SEMPAC’s “Open-Pakâ€â„¢ packages meet the latest JEDEC outline & footprint standards and are available in QFN,Semiconductors,Semiconductors and Related Devices Read More
