Description:
Semiconductor Manufacturing,Semiconductors and Related Devices,Semiconductor design and manufacturing services,custom embedded memory IP,specialty memory IP,IC design optimization (power,performance,area,yield),SerDes and other IP integration,multi-project wafer (MPW) services,2.5D and 3D packaging,high bandwidth memory HBM PHY,FinFET ASIC design and manufacturing services,FinFET-class custom embedded memory IP,high bandwidth memory HBM2/2.5D solutions,SerDes,7nm & 14/16nm HBM2 PHY,2.5D packaging,7nm & 14/16nm HBM2 PHY,FinFET-class market-specific IP platforms,HBM2/2.5D solutions,56G/112G PAM4 & NRZ SerDes Family,Ternary CAM,Highly configurable 7nm IP platform,56G/112G PAM4 & NRZ SerDes Family,Networking ASICs,5G infrastructure ASICs,AI and ML ASICs,High-performance computing ASICs,IP optimization,B2B,Semiconductors,Semiconductors and Related Devices,Electrical Electronic Manufacturing,Manufacturing Read More
